WebMar 19, 2024 · Flatness of the incoming silicon wafer is one major contributor to the ultimate focusing limitation of modern exposure tools. Exposure tools are designed to chuck wafers without creating non-flatness and then use focus control to follow as closely as possible the chucked wafer front surface topography. The smaller size of the exposure … WebSmart Stacking™ can be used for: Direct bonding and thinning: - Low stress and defect free bonding. - High bonding strength and quality. - Wafer-to-wafer alignment within +/-1μm. - High surface quality. - Improved edge exclusion management. High- and low-temperature bonding. Incoming wafers:
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WebWafer. A wafer is a physical unit used for manufacturing semiconductor devices. In general, it is made by slicing a silicon ingot (a cylindrical mass) into disk-shaped pieces of about 0.5mm to 1mm thick. Usually, silicon wafers with a 5-inch (125mm) diameter, 8-inch (200mm) diameter and 12-inch (300mm) diameter are used. citibank savings high yield
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